Chipboard with BROSZEIT HPL Basics Back side backing

Core: Chipboard P2 18 mm
Format: 3050 × 1220 mm raw edges no cut o size
Surface: HPL 0.8 mm on both sides
Glue: PVAC white glue D3 (D4 on request)
Décors can be coated with standard colours Basics
Backside: K100 Korpusweiss Basiscs
On request, we can also offer you composite elements with HPL from Egger, Kronospan or Pfleiderer.