Chipboard with BROSZEIT HPL Basics

Core: Chipboard P2 18 mm
Format: 3050 × 1220 mm raw edges no cut o size
Surface: HPL 0.8 mm on both sides
Glue: PVAC white glue D3 (D4 on request)
Decors can be coated on both sides with standard colours Basics
On request, we can also offer you composite elements with HPL from Egger, Kronospan or Pfleiderer.